Infinix creates a “3D Vapor Cloud Chamber”, which improves on conventional designs by 3°C
Infinix has developed an improved vapor chamber cooling system that it calls “3D Vapor Cloud Chamber” (3D VCC). Compared to conventional designs, it reduces the temperature of the chipset by 3°C, according to the company. The way it does this is by improving the contact between the chipset and the vapor chamber itself. Phone VCs…